CONDUCT-O-FIL® Conductive Particles: Electronics Assembly

The breadth of the Conduct-O-Fil® product line is ideally suited to electronic assemblies requiring high conductivity in combination with other performance attributes, such as galvanic compatibility, corrosion resistance, heat transfer or dissipation or EMI shielding, including Mil-Spec shielding requirements. An excellent replacement for silver and nickel, Conduct-O-Fil® particles reduce cost and weight without compromising performance .

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